KTU Rework - Samsung GT-I9300 Galaxy SIII
Following Case sample shows you rework jobs on damaged Samsung GT-I9300 Galaxy S III:
First we will show you how to dismantle the Samsung Galaxy S III. If the display glas has split (like on the phone you can see) then you should be careful as it can crack into small sharp pieces.
We advice for people who generaly do not need glases, to use protective spectacles. The spectacles we show you here are also used in the automotive sector in the work areas where sparks from robotics can fly into your eyes. Our CEO once got a spark in his eye during his training at BMW and therefore warns those who think they do not need to follow work safety guidelines.
Remember: work safety always comes first!!
Part 1 - dismantle Galaxy S 3
Part 2 - prepare for rework
You first must have removed all detachable parts from the PCB.
Then if necessary cover with the silver foil / Sticker the areas you do not want to heat.
Then put BGA flux on the part you want to work on. this is to spread the heat nicely over the entire suface of the chip
Then fix the PCB into the holders of the Preheater.
Next adjust the hand piece to be located exactly over the part you want to work on. If necessary, move the Holder sideways or the other shifting holder backwards.
No select the right hat for you handpiece. Remember: the smaller the part we work on ... the smaller the opening should be. We have different hats available for you.
part 3 - do the rework using Turbo IR
Now we start up Turbo IR.
We can select Freehand mode or Automode (read about the difference >> here >>).
We select Freehandmode and press on run, by turning the wheel so it indicated to "run".
Now press inwards the round button.
Now we turn the wheel so that we jump to "pre" (=preheater).
Now we push inwards the button and hold thisposition. With this beeing pushed inwards, we turn the wheel slowly so that we increase the level of heat from 0 to 1.
this makes the preheater start up and the pcb gets slowly warmed up from the bottom. We do this in oder to avoid the pcb getting damaged when we apply from the top the heat we need to melt the bga balls under the chip.